You have a 4‑layer board. Do you really need that specific stackup? What if you go to 6 layers? And how do you decide between copper‑filled microvias and standard through‑holes?
Getting the stackup right is one of the most important – and most overlooked – decisions in PCB design. A good stackup saves cost, improves signal integrity, reduces EMI, and makes manufacturing easier. A bad stackup will haunt you until the board spins again.
This guide walks you through the key parameters, trade‑offs, and real‑world examples. No abstract theory – just practical advice you can use today.
1. What a stackup actually defines
The stackup tells the fabricator:
- Number of copper layers
- Order of layers (which signal layer is adjacent to which plane)
- Thickness of each dielectric layer (prepreg and core)
- Copper weight (1 oz, 0.5 oz, 2 oz, …)
- Material type (FR‑4, high‑Tg, Rogers, etc.)
Your EDA tool’s default stackup is rarely optimal for your specific design. Always customize it.
2. The golden rule: symmetry
A symmetrical stackup is the single most important rule for avoiding warpage.
Symmetricalmeans the construction above the center of the board mirrors the construction below it.
Why? During lamination and reflow, unbalanced copper and uneven dielectric thickness cause the board to bend. A symmetric stackup cancels those stresses.
Practical implication: For a 4‑layer board, the classic Signal‑GND‑PWR‑Signal stackup is already symmetric if both outer layers have the same copper weight and prepreg thicknesses are equal.
3. The 2‑layer board (simple but limited)
2‑layer is fine for low‑speed, low‑density designs (e.g. Arduino shields, simple LED drivers, hobby projects).
Stackup example:
Top: signal + component placement
Bottom: signal + ground pour
Problems:
- No continuous ground plane → return paths are long → high EMI.
- Impedance control is almost impossible.
- High‑speed signals (＞50 MHz) will likely fail.
**When to upgrade: **If you have a microcontroller clock above 20‑30 MHz, or any high‑speed interface (USB, Ethernet, CAN‑FD), move to 4 layers.
4. The 4‑layer sweet spot – most designs
The classic 4‑layer stackup is the best price/performance for the majority of commercial, industrial, and even many automotive designs.
Recommended stackup:
Why it works:
- Every signal layer has an adjacent solid plane (ground or power) → controlled impedance and short return paths.
- The two inner layers shield outer signals from each other.
- Symmetric construction prevents warpage.
Copper weight: Usually 1 oz on outer layers, 0.5 oz on inner layers (for impedance and cost).
Total thickness: Typically 1.6 mm. You can go thinner (1.0 mm) for smaller products, but check with your fab.
5. The 6‑layer board – when 4 layers are not enough
You need 6 layers when:
- You run out of routing space on a 4‑layer board.
- You have multiple high‑speed interfaces and need to isolate them.
- You need two separate ground planes (e.g., analog and digital) with a single connection point.
Recommended stackup:
Why this order:
- Layer 2 and 5 are solid ground planes – excellent shielding.
- Layer 3 is a stripline (referenced to GND above and below) – great for sensitive clocks and high‑speed signals.
- Symmetric: top and bottom are signal, inner pairs are GND‑SIG‑PWR‑GND.
This stackup costs about 40‑60% more than a 4‑layer board but offers significantly better signal integrity and EMI performance.
6. The 8+ layer board – only when necessary
Beyond 6 layers, each additional layer adds significant cost and complexity. Reserve 8+ layers for:
High‑pin‑count BGAs (0.5 mm pitch or finer)
Complex DDR routing (e.g., DDR3/DDR4)
Multi‑rail power distribution with dedicated planes
Mixed high‑speed analog and digital
Common 8‑layer stackup:
This gives you multiple stripline layers and very low impedance power delivery.
Cost reality: An 8‑layer board can be 2‑3 times more expensive than a 4‑layer board. Only add layers when your routing density truly requires them.
7. Key parameters you must specify
When you send your stackup to the manufacturer, include these numbers – don‘t leave them guessing.
Most fabs have preferred prepreg stacks. Ask them for a “standard stackup” for your layer count and thickness – it‘s cheaper and faster.
8. Impedance control – tell them explicitly
If you need controlled impedance, do not assume the fab will figure it out. Write it clearly in your readme.
Example:
“Top layer USB differential pairs: target impedance 90 Ω ±10%. Provide recommended trace width and spacing based on your stackup.”
The fab will adjust trace widths or stackup to meet your target. They may ask you to accept small changes – that‘s normal.
9. Cost drivers for stackup
Standard FR‑4 1.6 mm, 1 oz outer / 0.5 oz inner, 4 layers is the cheapest reliable option. Only add features if you absolutely need them.
10. Quick decision flow
Final thoughts
Don‘t start with a default stackup. Think about your signals, your power distribution, and your budget.
- Most designs are perfectly happy with 4 layers.
- Symmetry prevents warpage – always balance copper and dielectric thickness.
- A dedicated ground plane next to each signal layer is the single best EMI reduction technique.
Before you send your Gerbers, export the stackup table from your EDA tool and paste it into a readme file. The fab will thank you – and your boards will work.
This article is brought to you by AnyPCBA, a small‑to‑medium volume PCB manufacturer. We offer free DFM reviews and stackup recommendations. Visit our website to get started.
